The first step is measuring how much the part has warped with the current processingm conditions. To identify which is major cause of warpage in an analysis, you need to run the warp analysis with "isolate cause of warpage" refer the below linkġ. 1) differential shrinkage - Packing profile need to be adjusted or increase / decrease gate & runner sizes or add (or delete) gates or thickness optimizationĢ) differential temperature - cooling circuits need to be modified in such a way we are having almost uniform core & cavity temperatureģ) differential orientation - gate need to be placed in a way to get uniform orientation of fiberĤ) corner effects - only applicable to mid-plane and DD meshes, where heat is getting accumulated the corners of a box type structures - cooling or part design need to optimized (.
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